The three-day 2026 Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition (SICE 2026) concluded successfully on the afternoon of May 16 at the Hangzhou Grand Convention and Exhibition Center.




Centered on the theme "Connecting the Semiconductor Ecosystem, Creating New Opportunities through Intelligent Manufacturing," the exhibition leveraged the Yangtze River Delta's strategic position as China's premier integrated circuit (IC) industry hub and Hangzhou's strong foundation in the digital economy. It introduced an innovative five-in-one industrial platform integrating exhibitions, forums, business matchmaking, investment promotion, and talent recruitment. By effectively connecting leading IC industry clusters across the Yangtze River Delta, including Shanghai, Suzhou, and Wuxi—the event brought together high-quality resources spanning the entire semiconductor and integrated circuit value chain. It provided strong momentum for regional industrial collaboration, the advancement of domestic semiconductor substitution, and the development of secure and resilient supply chains, further establishing itself as a premier annual event for China's integrated circuit industry, recognized for its professionalism, market orientation, and international reach.


The 2026 Hangzhou Changxin Expo focused on key segments of the semiconductor and integrated circuit (IC) industry, showcasing a highly specialized exhibition distinguished by its technical depth, precision, and quality. The event demonstrated a strong industry clustering effect and delivered impressive operational results across multiple metrics. Covering a total exhibition area of 30,000 square meters, the expo brought together 173 leading domestic and international enterprises and top-tier research institutions as exhibitors, while attracting representatives from more than 600 upstream and downstream industry leaders from around the world for networking and business exchange.
The exhibits covers a wide range of the entire semiconductor value chain, including IC design, wafer fabrication, packaging and testing, advanced semiconductor manufacturing equipment, critical semiconductor materials, EDA (Electronic Design Automation) tools, Chiplet-based advanced packaging, third-generation semiconductors, AI computing chips, and a wide range of end-use applications. Together, they provided a comprehensive showcase of China's latest technological advancements in the integrated circuit industry and the innovation-driven development of its entire industrial ecosystem.


With a strong emphasis on targeted business matchmaking, the exhibition addressed key supply-and-demand challenges across the semiconductor industry and effectively bridged information gaps between upstream and downstream stakeholders, delivering substantial business outcomes. The event attracted more than 30,000 professional visits, including 9,168 core targeted industry professionals and 1,837 overseas visitors. Attendees represented a broad cross-section of industries, including semiconductor manufacturing, electronics, new energy vehicles, aerospace, medical electronics, research institutions, universities, and industrial investment organizations. The exhibition ranked among the industry's leading events in terms of both the professionalism of its audience and the quality of business matching opportunities.
By the close of the exhibition, 17 major cooperation agreements had been signed on-site, while 121 additional cooperation intentions had been established, with the total value of intended collaborations exceeding RMB 13.9 billion (approximately USD 1.9 billion).


To further empower technological innovation and foster a collaborative industry ecosystem, the exhibition hosted 16 high-level industry forums and specialized events alongside the exhibition. Key highlights included the Hangzhou New Era Semiconductor Development Summit, the Advanced Packaging and Testing Technology Forum, the Semiconductor Materials and Equipment Innovation Forum, the AI Photonics Integration and Computing Interconnect Forum, the RISC-V Ecosystem Summit, the Integrated Circuit Talent Development Conference, and the Industrial Investment Matchmaking Conference, among other thematic events.
The forum program brought together academicians, renowned industry experts, senior executives from leading enterprises, and prominent investment professionals to engage in in-depth discussions on critical issues shaping the industry's future. Topics included breakthroughs in core technologies, strategies for semiconductor localization, supply chain security, high-end talent development, and the role of capital in driving industrial growth. By sharing cutting-edge technological achievements, assessing emerging industry trends, and fostering consensus on collaborative development, the event provided both valuable strategic insights and practical guidance to support the high-quality development of China's integrated circuit industry.



The event attracted extensive attention from both domestic and international industry media, generating comprehensive, multi-channel coverage throughout its duration. More than 300 leading industry media outlets provided continuous reporting through a variety of formats, including news updates, in-depth interviews, live video broadcasts, industry analysis, and special feature reports. Together, these efforts created an integrated online and offline communications network that showcased the exhibition's achievements and highlighted the innovation capabilities of China's semiconductor industry.
The broad media exposure further enhanced Hangzhou's reputation as a leading integrated circuit hub in the Yangtze River Delta, strengthened its influence and appeal within the global semiconductor community, attracted international industry resources, and reinforced the region's position as a premier destination for semiconductor innovation and industrial development.



The successful staging of the SICE 2026 represents a concrete step in advancing the Yangtze River Delta's strategy for integrated industrial development. The event successfully established a high-level cooperation platform for the integrated circuit (IC) industry, connecting global partners while serving stakeholders across China. By promoting the deep integration of the industrial, supply, innovation, capital, and talent value chains, the exhibition helped address gaps in industry collaboration, improve the circulation of resources across the sector, strengthen regional industrial synergies, and further reinforce the core competitiveness of the Yangtze River Delta's integrated circuit industry cluster.
The exhibition also focused on the industry's most pressing priorities—including semiconductor localization, supply chain resilience, and emerging application scenarios—providing enterprises with an efficient platform for technology exchange, business matchmaking, investment promotion, talent recruitment, and market expansion. In doing so, it enabled Chinese semiconductor companies to overcome technological barriers, expand into both domestic and international markets, connect with high-quality investment resources, and accelerate the high-quality, self-reliant development of the industry.
Although the show has successfully concluded, its long-term value in fostering industrial empowerment, resource integration, and ecosystem collaboration will continue to generate lasting impact. Looking ahead, the exhibition will remain committed to serving the entire semiconductor and integrated circuit value chain by continuously enhancing its service offerings, expanding its scale and quality, enriching its portfolio of high-level forums, and improving the precision of industry matchmaking. Through ongoing efforts to strengthen its international reach, professional standards, and brand influence, the expo aims to become one of Asia's most influential benchmark events for the integrated circuit industry, while continuing to support the rapid, high-quality development of China's semiconductor sector.
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